The Nova Integration Solutions (NIS) Class 3200 contains a portfolio of “hybrid cooled” enclosures defined air cooling over a sealed, conduction cooled chassis. The Class 3200 ATR reference designs conform to standard ARINC 404A sizes (1/4 Short to 1 ½ Long) while also being fully scalable and capable of housing all Eurocard board types, form factors and slot counts.
All NIS ATR Chassis utilize a machined aerospace grade aluminum alloy #6061-T651 housing with formed aluminum internal structures. This housing design provides superior strength and rigidity while also ensuring MIL-STD-461 compliance for EMI/EMC.
NIS engineering specializes in advanced thermal management and packaging techniques with the design process starting by considering the most efficient cooling method based on the environment and program specifications. Prior to PDR, FEA thermal analysis presentations are shown validating the design direction under worst case scenarios (high altitude, high ambient temperature and full power load). Fan type, heat sink geometry (thickness, length and orientation) as well as heat piping or advanced materials are considered if necessary. The Class 3200 offers the most aggressive cooling options of any ATR product line.
The Class 3100 ATR Chassis accommodate up to an 18-slot cPCI, VME, or VPX backplane. Fully compliant with IEEE 1101.2, the internal subrack is fully machined and ready to accept various types of wedgelocks for 3U or 6U convection-cooled plug-in boards on 0.8”, 0.85” or 1.0” pitch.
Power supply options include fixed or plug in style power supplies with outputs up to 2kW. Input power options include single or three phase VAC inputs including 100-264 VAC @ 47-63 Hz; 115 VAC @ 400 Hz; and nominal VDC inputs from 12VDC up to 270VDC. Custom power systems can be designed in collaboration with parent company Technology Dynamics, Inc.
I/O connector options include D38999 Series-III, MIL-STD-26482 and other circular types commonly found in military electronic systems. For moderate to large unit volume, NIS will design an I/O printed circuit board to reduce cabling complexity and direct labor costs, passing those savings to you, our customer.